Module COM Express Type 6 Axiomtek CEM312
The MIRU130 is a high-end embedded vision and AI motherboard optimized for machine vision and deep learning applications. It is powered by the onboard AMD Ryzen™ Embedded V1807B/V1605B processor with AMD Radeon™ RX Vega graphics. The embedded vision board has two PoE GbE LAN ports for camera interfaces and an integrated real-time vision I/O that includes 4-CH isolated DIO. The size of MIRU130 is 244 x 170mm – the size between Micro-ATX and Mini-ITX form factor, which provides customers with the convenience of finding chassis on the market. Its vision-specific I/O integrates 2-CH trigger input, 2-CH LED lighting controller, 2-CH camera trigger output and an encoder input for conveyor tracking. Furthermore, the MIRU130 is integrated with AMD Radeon™ RX Vega graphics with support of DirectX 12 and offers dual display capability through one HDMI and one DisplayPort interfaces. The MIRU130 was designed to help developers to deploy vision-based AI applications faster and easier.
Tính năng
- Intel® Atom® x5 and x7 processors (Apollo Lake)
- 2 DDR3L-1600 SO-DIMM for up to 8GB of memory
- Max. up to 4 lanes of PCI Express
- 2 SATA-600
- 4 USB 3.0 and 8 USB 2.0
- AXView 2.0 intelligent remote management software
- TPM 1.2 supported (optional)
Thông số kỹ thuật
| CPU |
- Intel® Atom® x7-E3950 (2.0 GHz)
- Intel® Atom® x5-E3940 (1.8 GHz)
- Intel® Atom® x5-E3930 (1.8 GHz)
|
| Chipset |
|
| System Memory |
- 2 x 204-pin SO-DIMM DDR3L-1600, up to 8GB
|
| BIOS |
|
| Serial |
|
| USB |
|
| Ethernet |
- 1 x 10/100/1000 Mbps (Intel® i210-IT)
|
| Display |
- 2 x DDI (DP, HDMI, DVI); VGA optional
- 1 x LVDS (eDP option)
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| GPIO |
|
| Audio |
- HD link interface to baseboard for Codec
|
| Storage |
- 2 x SATA-600
- eMMC 5.0 64GB (optional)
|
| Expansion |
- 4 x PCIe (3 lanes while internal LAN is connected)
|
| Others |
- 1 x LPC
- 1 x SPI
- TPM 1.2 (optional)
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| Battery |
|
| Power Input |
|
| Watchdog Timer |
- 65536 levels, 0 to 65535 sec.
|
| Hardware Monitoring |
|
| Operating Temperature |
- -40°C to +85°C (-40°F to +185°F)
|
| Relative Humidity |
- 10% to 95% relative humidity, non-condensing
|
| Vibration |
|
| Dimensions |
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| Board Thickness |
|
| Certifications |
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Thông tin đặt hàng
CEM312PG-E3950 (P/N-E38D312100)
COM Express Type 6 Compact module with Intel® Atom® x7-E3950, DDI, LVDS, USB 3.0 and GbE LAN
CEM312PG-E3940 (P/N-E38D312101)
COM Express Type 6 Compact module with Intel® Atom® x5-E3940, DDI, LVDS, USB 3.0 and GbE LAN
CEM312PG-E3930 (P/N-E38D312103)
COM Express Type 6 Compact module with Intel® Atom® x5-E3930, DDI, LVDS, USB 3.0 and GbE LAN
CEB94011 (P/N-E394011100)
COM Express Type 6 evaluation board
7128D312000E
CEM312 heatspreader
7118D312000E
CEM312 heatshink
Tài liệu
Datasheet
